Logo

Educated Owl Books
Help Login / SignUp (0)
Sell with us!
3D Microelectronic Packaging : From Architectures to Applications

3D Microelectronic Packaging : From Architectures to Applications

by Yan Li, Deepak Goyal Hardcover 2020

⭐ 0.0 rating
⭐ 0.0 out of 5 0 global ratings
5 star
65%
4 star
20%
3 star
10%
2 star
3%
1 star
2%
| 📖 0 saved | ✅ 0 verified
  • Author: Yan Li, Deepak Goyal
  • ISBN 13: 9789811570896
  • ISBN 10: 9811570892
  • Publication Year: 2020
  • Language: English

Specifications

Index-109811570892
LanguageEnglish
Index-139789811570896
Period-
Class Track-
Publisher- (2020)
Pages-

✨ Readers also enjoyed...

View All →
China's Soviet Dream : Propaganda, Culture, and Popular Imagination

China's Soviet Dream : Propaganda,…

Yan Li

Inquire
Cyber-Physical Microgrids

Cyber-Physical Microgrids

Yan Li

Inquire
Cyber-Physical Microgrids

Cyber-Physical Microgrids

Yan Li

Inquire
EEG Signal Analysis and Classification : Techniques and Applications

EEG Signal Analysis and Classifica…

Siuly Siuly, Yan Li, Yanchun Zhang

Inquire
EEG Signal Analysis and Classification : Techniques and Applications

EEG Signal Analysis and Classifica…

Siuly Siuly, Yan Li, Yanchun Zhang

Inquire