Logo

Educated Owl Books
Help Login / SignUp (0)
Sell with us!
3D Stacked Chips : From Emerging Processes to Heterogeneous Systems

3D Stacked Chips : From Emerging Processes to Heterogeneous Systems

by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis Paperback 2018

⭐ 0.0 rating
⭐ 0.0 out of 5 0 global ratings
5 star
65%
4 star
20%
3 star
10%
2 star
3%
1 star
2%
| 📖 0 saved | ✅ 0 verified
  • Author: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
  • ISBN 13: 9783319793054
  • ISBN 10: 3319793055
  • Publication Year: 2018
  • Language: English

Specifications

Index-10 3319793055
Index-13 9783319793054
Language English

✨ Readers also enjoyed...

View All →
3D Stacked Chips : From Emerging Processes to Heterogeneous Systems

3D Stacked Chips : From Emerging P…

Ibrahim (Abe) M. Elfadel, Gerhard Fettweis

Inquire
Secure, Low-Power IoT Communication Using Edge-Coded Signaling

Secure, Low-Power IoT Communicatio…

Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel

Inquire
Secure, Low-Power IoT Communication Using Edge-Coded Signaling

Secure, Low-Power IoT Communicatio…

Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel

Inquire
Tapered Beams in MEMS : A Symbolic Modeling Framework with Applications to Energy Harvesting

Tapered Beams in MEMS : A Symbolic…

Wajih U. Syed, Ibrahim (Abe) M. Elfadel

Inquire
The Iot Physical Layer : Design and Implementation

The Iot Physical Layer : Design an…

Ibrahim (Abe) M. Elfadel, Mohammed Ismail

Inquire