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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module : Ceramic Research and Development in Japan

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module : Ceramic Research and Development in Japan

by K. Otsuka Hardcover 1993

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  • Author: K. Otsuka
  • ISBN 13: 9781851665792
  • ISBN 10: 185166579X
  • Publication Year: 1993
  • Language: English

Specifications

Index-10 185166579X
Index-13 9781851665792
Language English

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