Thermal Stress and Strain in Microelectronics Packaging
by John Lau Paperback 2012
- Author: John Lau
- ISBN 13: 9781468477696
- ISBN 10: 1468477692
- Publication Year: 2012
- Language: English
Specifications
Index-101468477692
LanguageEnglish
Index-139781468477696
Period-
Class Track-
Publisher- (2012)
Pages-
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