Manufacturing Processes and Materials Challenges in Microelectronic Packaging : Presented at the Winter Annual Meeting of the American Society of Mech
by W. T. Chen, Peter A. Engel, W. E. Jahsman, Winter Meeting Sta American Society of Mechanical Engineers, Applied Mechanics American Society of Mechanical Engineers Hardcover
- Author: W. T. Chen, Peter A. Engel, W. E. Jahsman, Winter Meeting Sta American Society of Mechanical Engineers, Applied Mechanics American Society of Mechanical Engineers
- ISBN 13: 9780791808962
- ISBN 10: 0791808963
- Language: English
Specifications
| Index-10 | 0791808963 |
|---|---|
| Index-13 | 9780791808962 |
| Language | English |
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