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Microelectronics Packaging Handbook Pt. III : Subsystem Packaging

Microelectronics Packaging Handbook Pt. III : Subsystem Packaging

by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein Hardcover 1997

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  • Author: Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
  • ISBN 13: 9780412084515
  • ISBN 10: 0412084511
  • Publication Year: 1997
  • Language: English

Specifications

Index-10 0412084511
Index-13 9780412084515
Language English

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